说明
无说明配置
Film thickness measurementOEM 型号描述
MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.文件
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
已验证
类别
Thin Film / Film Thickness
上次验证： 30 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117026
晶圆尺寸：
8"/200mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
类别
Thin Film / Film Thickness
上次验证： 30 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
117026
晶圆尺寸：
8"/200mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Film thickness measurementOEM 型号描述
MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.文件
无文件