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说明
Wafer Bonder配置
无配置OEM 型号描述
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文件
无文件
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
101816
晶圆尺寸：
8"/200mm
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
AWB-08
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
101816
晶圆尺寸：
8"/200mm
年份：
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Bonder配置
无配置OEM 型号描述
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文件
无文件