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说明
无说明配置
-Unit setup for thermal bonding and hot embossing. -Windows 2000 -Unit setup for thermal bonding, not anodic bonding. -Will need to hook it to a three phase power source and compressed air/ nitrogen. -Fully operational -Last used in 2019OEM 型号描述
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder文件
EVGroup (EVG)
EVG520 HE
已验证
类别
Wafer Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
55796
晶圆尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部EVGroup (EVG)
EVG520 HE
类别
Wafer Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
55796
晶圆尺寸:
8"/200mm
年份:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available