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说明
无说明配置
BonderOEM 型号描述
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder文件
无文件
类别
Wafer Bonders
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled / Uncrated
产品编号：
116672
晶圆尺寸：
未知
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
类别
Wafer Bonders
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled / Uncrated
产品编号：
116672
晶圆尺寸：
未知
年份：
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
BonderOEM 型号描述
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder文件
无文件