说明
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm配置
无配置OEM 型号描述
Wafer Bonder文件
无文件
EVGroup (EVG)
EVG520
已验证
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105029
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG520
类别
Wafer Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
105029
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
• Tooling for 6" and 8” substrates inclusive Bond Chuck and Pressure Insert • Capable of fusion compression bonding • Capable of thermal compression bonding • Capable of anodic bonding • Capable of polymer bonding • Ideal for R&D and pilot production applications • High-vacuum capable bond chamber • Auto opening of bond tool cover • Windows based control software and operation interface • Wafer size: up to 150mm capable • Max Bond Force: 10 kN • Top side heater: 550°C max. in 1°C steps • Bottom side heater: 550°C max. in 1°C steps • Temperature uniformity: ± 1,5 % • Turbo pump and controller • Roughing pump • Load/unload tool • System computer, monitor, and keyboard • Fully automated processing with manual loading and unloading coupled with external cooling stations • Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under inert atmosphere • Turbomolecular pumping system & PC-based control • Programmable recipe editing & automatic data logging • Chamber vacuum: Pumping down to 1E-3 mbar within 30mins • Electrical voltage: Up to max. of 2kV • Bonding stack thickness: Up to 2.5mm配置
无配置OEM 型号描述
Wafer Bonder文件
无文件