EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.

EVGroup (EVG)

EVG501

Wafer Bonders

类似上架物品

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVG501

Wafer Bonders

类似上架物品

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501

EVGroup (EVG)

EVG501