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说明
Wafer Bonder配置
Wafer BonderOEM 型号描述
Up to 200 mm Wafer Bonding文件
无文件
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
43269
晶圆尺寸：
8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
CB200M
类别
Wafer Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
43269
晶圆尺寸：
8"/200mm
年份：
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Bonder配置
Wafer BonderOEM 型号描述
Up to 200 mm Wafer Bonding文件
无文件