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说明
Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg配置
无配置OEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
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DISCO
DFG840
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79146
晶圆尺寸：
未知
年份：
未知
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说明
Slicer Cutter Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafer. The equipment has good stability. The company has a professional after-sales team to provide relevant installation, commissioning and maintenance services. Rated power: ac200v, 50 / 60Hz, 17kwv Compressed air: 0.5MPa 300l/mi Grinding water: 0.2MPa 15L / min L cooling water: 0.2MPa 11L / min Weight: 2300kg配置
无配置OEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
无文件