说明
Thinning machine配置
Back-side GrinderOEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
无文件
类似上架物品
查看全部
DISCO
DFG840
类别
Wafer Grinding
上次验证： 28 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
136849
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Thinning machine配置
Back-side GrinderOEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
无文件