说明
Back Grinder配置
无配置OEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
无文件
DISCO
DFG840
已验证
类别
Wafer Grinding
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111756
晶圆尺寸：
未知
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG840
类别
Wafer Grinding
上次验证： 29 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
111756
晶圆尺寸：
未知
年份：
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Back Grinder配置
无配置OEM 型号描述
The Disco DFG840 and 841 Systems have two-spindle, two-chuck table specifications and a robot arm. These machines feature a same-cassette return function. The robot arm vacuum ensures that even thin-ground wafers, which are prone to warping, are corrected to the required flatness for trouble-free handling.文件
无文件