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DISCO DFG850
    说明
    Full Grinder
    配置
    无配置
    OEM 型号描述
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Wafer Grinding

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    120872


    晶圆尺寸:

    未知


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    DISCO

    DFG850

    verified-listing-icon
    已验证
    类别
    Wafer Grinding
    上次验证: 60 多天前
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    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    120872


    晶圆尺寸:

    未知


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Full Grinder
    配置
    无配置
    OEM 型号描述
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    文件

    无文件