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DISCO DFG850
    说明
    working condition
    配置
    无配置
    OEM 型号描述
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Wafer Grinding

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    62890


    晶圆尺寸:

    未知


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    DISCO

    DFG850

    verified-listing-icon
    已验证
    类别
    Wafer Grinding
    上次验证: 60 多天前
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/9d51e01542584602875d5ffc7c31ad0f_45fcce2b7d914528bffae9965c3ed9a11201a_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/e5e9873e63154c2993df4ee83645edee_711ec4727b224d59b2e0c9bd9ce7dcb31201a_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/b07b39af7be8425caeb36806b66b563e_71303313c0104f839368f5d7a2af93111201a_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/252207c7d6d94d74ab5e0fc98fa36a05_2047fed18af94c08825e126357f4f9311201a_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/9b5c62bc42c249d1ab046c30ddb36583_6a4e9a28daf94bed82f3993db71747121201a_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/2a8bc987b1bb414f91a1a134c07e3a86_4b10460599354b0c8741447e797024ec_mw.jpeg
    listing-photo-103161ba90ae4cbfb1d0a514c735495c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46857/103161ba90ae4cbfb1d0a514c735495c/2513a5249aed4d30991df3ac6a2340cb_f888f708ef4b4478aea39799424691cd_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    62890


    晶圆尺寸:

    未知


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    working condition
    配置
    无配置
    OEM 型号描述
    The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.
    文件

    无文件