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C1 Line, A1 Underfloor Storage Facility配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
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DISCO
DFG850
类别
Wafer Grinding
上次验证： 27 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124599
晶圆尺寸：
5"/125mm, 6"/150mm
年份：
未知
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说明
C1 Line, A1 Underfloor Storage Facility配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
无文件