说明
C1 Line, A1 Underfloor Storage Facility配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
无文件
DISCO
DFG850
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
124599
晶圆尺寸：
5"/125mm, 6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
C1 Line, A1 Underfloor Storage Facility配置
无配置OEM 型号描述
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文件
无文件