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DISCO DFG8560
    说明
    Backside grind
    配置
    无配置
    OEM 型号描述
    The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
    文件

    无文件

    PREFERRED
     
    SELLER
    verified-listing-icon

    已验证

    类别
    Wafer Grinding

    上次验证: 60 多天前

    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    118476


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    PREFERRED
     
    SELLER

    DISCO

    DFG8560

    verified-listing-icon
    已验证
    类别
    Wafer Grinding
    上次验证: 60 多天前
    listing-photo-1b085f0412b44901b2183a933e6cc1c6-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    118476


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Backside grind
    配置
    无配置
    OEM 型号描述
    The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.
    文件

    无文件