说明
Disco - DFG8560 Grinder配置
Historical Usage: Less than 3,400 wafers processed, 170 hours total grinding time Standard Equipment / Configuration 300mm maximum wafer size; minimum wafer size 8-inch Two 4.8 kW air-bearing spindles Wafer rotation table with two-cassette flow and spinner washing unit Vacuum unit with coolant tank for supplying water to the grinding wheels Three universal chuck tables (8-inch–12-inch type) Height sensor for monitoring wafer thickness during grinding Three grinding wheels — coarse, fine, and self-grind Three dresser boards — coarse, fine, and self-grind 5mm block gauge and run-out measurement jig Complete set of manuals Windows-based operating system with graphical user interface Transportation jig / hoist Standard required tool set Additional Options / Special Features 8-inch and 12-inch Thin Grinding Kit — YFJV27-01A DTU152 spindle cooling recirculating temperature controller — YFJV12-02A Auto wheel setup — YFJV16-01AOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
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DISCO
DFG8560
类别
Wafer Grinding
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
154533
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2019
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Disco - DFG8560 Grinder配置
Historical Usage: Less than 3,400 wafers processed, 170 hours total grinding time Standard Equipment / Configuration 300mm maximum wafer size; minimum wafer size 8-inch Two 4.8 kW air-bearing spindles Wafer rotation table with two-cassette flow and spinner washing unit Vacuum unit with coolant tank for supplying water to the grinding wheels Three universal chuck tables (8-inch–12-inch type) Height sensor for monitoring wafer thickness during grinding Three grinding wheels — coarse, fine, and self-grind Three dresser boards — coarse, fine, and self-grind 5mm block gauge and run-out measurement jig Complete set of manuals Windows-based operating system with graphical user interface Transportation jig / hoist Standard required tool set Additional Options / Special Features 8-inch and 12-inch Thin Grinding Kit — YFJV27-01A DTU152 spindle cooling recirculating temperature controller — YFJV12-02A Auto wheel setup — YFJV16-01AOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
无文件