说明
无说明配置
Process: Backgrinding Mode: Fully-autoOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
无文件
DISCO
DFG8560
已验证
类别
Wafer Grinding
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
100908
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
DISCO
DFG8560
类别
Wafer Grinding
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
100908
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Backgrinding Mode: Fully-autoOEM 型号描述
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文件
无文件