说明
无说明配置
Process: Backgrinding Mode: Fully-autoOEM 型号描述
Discontinued Mar. 2006文件
无文件
DISCO
DFG860
已验证
类别
Wafer Grinding
上次验证: 17 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
63108
晶圆尺寸:
8"/200mm, 12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG860
类别
Wafer Grinding
上次验证: 17 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
63108
晶圆尺寸:
8"/200mm, 12"/300mm
年份:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Process: Backgrinding Mode: Fully-autoOEM 型号描述
Discontinued Mar. 2006文件
无文件