说明
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg配置
无配置OEM 型号描述
Discontinued Mar. 2006文件
无文件
DISCO
DFG860
已验证
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79180
晶圆尺寸：
未知
年份：
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG860
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79180
晶圆尺寸：
未知
年份：
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Grinder thinning machine Disco dfg860 wafer ultra-thin grinding equipment, 3 disk rotatable design, high precision, good stability, high efficiency. Suitable for 12 inch wafer back grinding and thinning. Rated power: ac200v, 50 / 60Hz, 21kwv Compressed air: 0.5MPa 350l/mi Grinding water: 0.2MPa 25L / min L cooling water: 0.2MPa 9L / min Weight: 5000kg配置
无配置OEM 型号描述
Discontinued Mar. 2006文件
无文件