说明
Tool is complete配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件
OKAMOTO
GNX-300
已验证
类别
Wafer Grinding
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
93029
晶圆尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
OKAMOTO
GNX-300
类别
Wafer Grinding
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
93029
晶圆尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Tool is complete配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件