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说明
Grinder配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件
OKAMOTO
GNX-300
类别
Wafer Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79524
晶圆尺寸：
未知
年份：
未知
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说明
Grinder配置
无配置OEM 型号描述
Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.文件
无文件