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IPEC / WESTECH AVANTI 472
    说明
    This tool had been de-installed for 1 year, before that it was in production
    配置
    无配置
    OEM 型号描述
    The IPEC 472 wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity, and planarization on patterned/device wafers. The 472 features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the 472 is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility.
    文件

    无文件

    类别
    Wafer Polishing

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled


    产品编号:

    53578


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部

    IPEC / WESTECH

    AVANTI 472

    verified-listing-icon
    已验证
    类别
    Wafer Polishing
    上次验证: 60 多天前
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    listing-photo-d695f4d2111540218d3de5adc15e6583-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1419/d695f4d2111540218d3de5adc15e6583/15c78b62a8ff42ca9220c1f8d4da7db2_201842345450_mw.jpg
    listing-photo-d695f4d2111540218d3de5adc15e6583-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1419/d695f4d2111540218d3de5adc15e6583/b2dc28b478224d1c981872676af2fff3_s2277541_mw.jpg
    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled


    产品编号:

    53578


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    This tool had been de-installed for 1 year, before that it was in production
    配置
    无配置
    OEM 型号描述
    The IPEC 472 wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity, and planarization on patterned/device wafers. The 472 features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm, the 472 is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility.
    文件

    无文件

    类似上架物品
    查看全部