We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
ADE 6033T Wafer Thickness Measurement配置
WorkingOEM 型号描述
The Model 6033T, using ADE’s patented capacitive measurement principle, measures wafers for Thickness and Total Thickness Variation (TVV). Whenever semiconductor wafer inspection is required, the MicroSense Model 6033T offers a low cost method of achieving fast, accurate measurements on wafers up to 150mm in diameter.文件
无文件
类别
Wafer Testing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66065
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / MICROSENSE
6033T
类别
Wafer Testing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
66065
晶圆尺寸：
6"/150mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ADE 6033T Wafer Thickness Measurement配置
WorkingOEM 型号描述
The Model 6033T, using ADE’s patented capacitive measurement principle, measures wafers for Thickness and Total Thickness Variation (TVV). Whenever semiconductor wafer inspection is required, the MicroSense Model 6033T offers a low cost method of achieving fast, accurate measurements on wafers up to 150mm in diameter.文件
无文件