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LAM RESEARCH / SEZ SP323
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.
    文件

    无文件

    类别
    Wet Etch

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Refurbished


    运行状况:

    未知


    产品编号:

    65019


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH / SEZ

    SP323

    verified-listing-icon
    已验证
    类别
    Wet Etch
    上次验证: 60 多天前
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/f81cb5c0a8ce4136b04ed3ecbc0741eb_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/302e20e3632549599d8efadcf2d9907f_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/674f01cb603240c6b7d325f7a4423f13_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/b360eb6f3eef4fcbad37639a0f6e1fff_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/c099d0f92c60476fbd92a2534d10d06f_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/b4527892026f4a71bff3dd944e646226_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/eadf1b7bd7a040319c879ceebfccb208_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/52e670ec4c83427c96682be6e8ca3206_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/2282ff69d0624308aeb98f2f1da6a429_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/909a03fde8d84883adb459b2559c1b4a_screenshot20230601at10_mw.png
    listing-photo-57990fcb147b4268a445a8b44f554959-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1594/57990fcb147b4268a445a8b44f554959/67fc4178c0be4cf8b13e35612f686b9c_screenshot20230601at10_mw.png
    物品主要详细信息

    状况:

    Refurbished


    运行状况:

    未知


    产品编号:

    65019


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.
    文件

    无文件