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LAM RESEARCH / SEZ SP323
    说明
    Wet (Acid)
    配置
    WET
    OEM 型号描述
    The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Wet Etch

    上次验证: 16 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    102726


    晶圆尺寸:

    未知


    年份:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    LAM RESEARCH / SEZ SP323

    LAM RESEARCH / SEZ

    SP323

    Wet Etch
    年份: 2006状况: 二手
    上次验证16 天前

    LAM RESEARCH / SEZ

    SP323

    verified-listing-icon
    已验证
    类别
    Wet Etch
    上次验证: 16 天前
    listing-photo-a9c7f21f53104c00ab44abf441d6d930-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77853/a9c7f21f53104c00ab44abf441d6d930/6b75af2057e94e22a02795fbd77438bb_adwcrc03page1image0003_mw.jpg
    listing-photo-a9c7f21f53104c00ab44abf441d6d930-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77853/a9c7f21f53104c00ab44abf441d6d930/adfac33c857943b4ba36b2c8db2355c2_adwcrc03page1image0002_mw.jpg
    listing-photo-a9c7f21f53104c00ab44abf441d6d930-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77853/a9c7f21f53104c00ab44abf441d6d930/0b264040ba804645bfaebc6711956713_adwcrc03page1image0005_mw.jpg
    listing-photo-a9c7f21f53104c00ab44abf441d6d930-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77853/a9c7f21f53104c00ab44abf441d6d930/4464890f23e4443eacfccc0c76aaf8b4_adwcrc03page1image0001_mw.jpg
    listing-photo-a9c7f21f53104c00ab44abf441d6d930-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/77853/a9c7f21f53104c00ab44abf441d6d930/e9ffb86caa8540e09c70c2d92cd10248_adwcrc03page1image0004_mw.jpg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    102726


    晶圆尺寸:

    未知


    年份:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Wet (Acid)
    配置
    WET
    OEM 型号描述
    The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.
    文件

    无文件

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    查看全部
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