说明
Single Wafer Processing配置
无配置OEM 型号描述
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.文件
无文件
LAM RESEARCH / SEZ
SP4300
已验证
类别
Wet Etch
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
48208
晶圆尺寸：
12"/300mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / SEZ
SP4300
类别
Wet Etch
上次验证： 22 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
48208
晶圆尺寸：
12"/300mm
年份：
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Single Wafer Processing配置
无配置OEM 型号描述
The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.文件
无文件