Previously under Orbotech that KLA acquired in 2019.

SPTS Technologies provides advanced wafer processing solutions to the world's leading semiconductor and microelectronic device manufacturers. We make electronics possible.

KLA / SPTS

APM-011

MPX ICP PRO

The Xactix e2 is an ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system.

Key to successful research is process flexibility and the Xactix e2 provides the widest range of process options. Developed as the successor to the e1, the e2 retains ease of use, low cost of ownership and a small footprint, but adds additional options and even greater process flexibility.  



XACTIX e2

The Monarch 3 is a compact module includes a 3-wafer process chamber, and is designed for research laboratory and small volume production environments.
Third generation process chamber has been designed for easy wafer size changes and maintenance
Wafer loading options include a semi-automatic 3-wafer loader with load lock, and various cluster-based configurations

PRIMAXX MONARCH 3

Omega Synapse etch process module uses a high density plasma source and is designed to etch strongly bonded materials.

OMEGA SYNAPSE

Primaxx fxP - a cluster system supporting up to 6 Monarch 25 or Monarch 300 vapor HF etch chambers.
The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

PRIMAXX fxP

SPTS's uEtch is a single-wafer system specifically designed for university and small research laboratories.
  Can process single whole wafers (100-200mm) or die on a carrier
  HF vapor processes are transferable to SPTS 3- and 25-wafer production systems, offering a path from concept to production

PRIMAXX uETCH

The SPTS Omega Rapier is a deep silicon etcher that uses an inductively coupled plasma (ICP) etching system for etching deep features in silicon. It uses a fast switching Bosch process that produces smooth sidewall profiles while etching silicon up to 30 µm per minute. The Rapier module etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

OMEGA RAPIER

The accelerated etch rates and superior components make the Xactix X4 ideal for intensive R&D and pilot production. It is the leading XeF2 etch system for releasing MEMS devices.  

XACTIC X4

Xactix fxP - a cluster system supporting up to 6 CVE XeF2 etch chambers.
The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

XACTIX fxP

Omega fxP is a cluster system supporting up to 6 plasma etch (ICP, DRIE, and/or Synapse) chambers. The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

OMEGA fxP

XACTIX e1

OMEGA RAPIER DSI

DSi-v module offers higher etch rates and low nonuniformity for non-critical or high load cavity etching, and blanket
silicon etching for via reveal or thinning.

OMEGA DSi-v

MPX ICP

The CVE module is compatible with SPTS' cluster platforms, and has a unique chamber design which provides high etch rates, uniformity and efficiency. It is designed allow high volume production and the integration of  XeF2 modules with the other process modules available from SPTS.

XACTIX CVE

SPTS LPX APS is a wafer processing system designed for research and development applications in the semiconductor industry. It combines a manually loaded, single-wafer vacuum load-lock with SPTS's etch or deposition plasma sources, providing a cost-effective platform for R&D purposes. 


LPX APS

Versalis fxP - a cluster system supporting a mixture of etch and deposition process chambers (up to 6 modules in total), useful for R&D or pilot production, saving both capital expenditure and cleanroom footprint.
The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

VERSALIS fxP

SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The Omega ICP process module uses a patented high density plasma source incorporating a radial coil design. The  The ICP module is the industry leader for compound semiconductor applications.

Typical materials:

GaAs
GaN
SixNy
BCB and Polyimide

OMEGA ICP

The Primaxx® Monarch300 is a fully integrated, automated VHF etch tool designed to perform selective MEMS etch release via a controlled anhydrous HF/Alcohol etch process. The process provides a vapor phase, isotropic etch of sacrificial oxide to release a flexure or other device. No liquids are used in contact with these MEMS devices and therefore “stiction” creating conditions are avoided. A clean, residue-free release etch is accomplished without liquids or supercritical drying.
Compatible with 200mm & 300mm wafers
High throughput, high uptime 13-wafer batch processing
Process chamber, gas/liquid panel, and pressure/vacuum components, all within a small footprint



PRIMAXX MONARCH 300

Pegasus Rapier

The Monarch25 is a 25-wafer batch process module designed for medium to high volume HF release etch production applications in either the Primaxx® fxP or Primaxx® c2L configurations.
High throughput, high uptime 25-wafer batch processing
Process chamber, gas/liquid panel, and pressure/vacuum components, all within a small footprint
Extensive process control and monitoring functions ensure the yield, reliability and repeatability required in volume production

PRIMAXX MONARCH 25

SPTS’ Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging industries, particularly in applications where a low processing temperature is required. They are also used in the advanced packaging, RF, power, photonics and MEMS markets.

DELTA 201

DELTS APM 

Mosaic fxP - a cluster system supporting up to 6 plasma dicing chambers.
The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

MOSAIC fxP

The MVD300® (and MVD300E with an EFEM) are designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications.

MVD300E

The MVD100E is the designated tool for R&D or pilot manufacturing. It is designed for high performance, flexibility and reliability for the most demanding applications. Corporate and academic research labs have called it their most versatile and reliable piece of equipment.

MVD100E

MVD300

The MVD4500 is our panel and large substrate tool. It is capable of handling multiple substrates with sizes up to 930 x 720 mm. It is the only batch process tool capable of performing ALD and MVD on substrates in this size range. It is designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications.

MVD4500

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD. The system includes modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers. The new system is designed to address the technical challenges customers face as they scale power PVD processes up to 300mm wafer size.

SIGMA FXP 300

The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

SIGMA fxP

The Omega Etch Systems from SPTS offers advanced etch technologies for a wide range of applications within Advanced Packaging, MEMS, Photonics, Power Devices, and RF-IC.

OMEGA 201

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD.

SIGMA 200

Delta fxP - a cluster system supporting up to 6 PECVD chambers.
The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.

KLA / SPTS

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