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APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
说明
无说明
配置
Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
OEM 型号描述
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
文件
类别
CD-SEM

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

78760


晶圆尺寸:

12"/300mm


年份:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

VERASEM 3D

verified-listing-icon
已验证
类别
CD-SEM
上次验证: 60 多天前
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listing-photo-9b6fca9d5b7e4d4386c9cd15fea89684-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73362/9b6fca9d5b7e4d4386c9cd15fea89684/8f4cc88100f349588873bf9c639b7cf2_ee75c42d92c54f06b76724852403fdbb1201a_mw.jpeg
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

78760


晶圆尺寸:

12"/300mm


年份:

2001


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
Please see attached configuration Type: SMIF Wafer Size: 300mm Reticle Size: 6 inch Wafer OF Type: Notch at 6 Software Version: HDD Exiting No missing parts
OEM 型号描述
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
文件