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APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
  • APPLIED MATERIALS (AMAT) VERASEM 3D
说明
Wafer Testing And Metrology
配置
无配置
OEM 型号描述
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
文件

无文件

PREFERRED
 
SELLER
类别
CD-SEM

上次验证: 60 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

101264


晶圆尺寸:

12"/300mm


年份:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

APPLIED MATERIALS (AMAT)

VERASEM 3D

verified-listing-icon
已验证
类别
CD-SEM
上次验证: 60 多天前
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/3325dad73eea483fbcfa56c01ed1b25d_1ss_mw.png
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/b33ac4efab9b4131b8259ca8f90a9884_3ss_mw.png
listing-photo-faa1f4f2b09e48198a8538f0e0195430-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/faa1f4f2b09e48198a8538f0e0195430/564f9fc1a6544387859d951e02e987c3_2ss_mw.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

101264


晶圆尺寸:

12"/300mm


年份:

2023


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Testing And Metrology
配置
无配置
OEM 型号描述
The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
文件

无文件