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APPLIED MATERIALS (AMAT) VERASEM 3D
    说明
    无说明
    配置
    Complete
    OEM 型号描述
    The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
    文件

    无文件

    PREFERRED
     
    SELLER
    类别
    CD-SEM

    上次验证: 60 多天前

    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    102977


    晶圆尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    PREFERRED
     
    SELLER

    APPLIED MATERIALS (AMAT)

    VERASEM 3D

    verified-listing-icon
    已验证
    类别
    CD-SEM
    上次验证: 60 多天前
    listing-photo-d07f5ad65e1040fea73d2d620447f94f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46311/d07f5ad65e1040fea73d2d620447f94f/21872629ae124f32b93afa064c23079c_1703465955517_mw.jpg
    listing-photo-d07f5ad65e1040fea73d2d620447f94f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46311/d07f5ad65e1040fea73d2d620447f94f/20fb1d80dd0943a2903bfdefcc4c4562_1703465943818_mw.jpg
    listing-photo-d07f5ad65e1040fea73d2d620447f94f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46311/d07f5ad65e1040fea73d2d620447f94f/86f0e7f013664d5698d4f51aa482a976_1703465950299_mw.jpg
    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    102977


    晶圆尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Complete
    OEM 型号描述
    The AMAT VeraSEM 3D is an advanced semiconductor imaging system introduced by Applied Materials. It offers three-dimensional imaging capabilities for chip features as small as 0.10 micron, allowing users to gain valuable insights into semiconductor structures with high precision. The system's enhanced efficiency makes it a powerful tool for semiconductor analysis and research.
    文件

    无文件