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APPLIED MATERIALS (AMAT) CENTURA TxZ
  • APPLIED MATERIALS (AMAT) CENTURA TxZ
  • APPLIED MATERIALS (AMAT) CENTURA TxZ
  • APPLIED MATERIALS (AMAT) CENTURA TxZ
说明
HEATER
配置
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OEM 型号描述
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.
文件

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类别
CVD

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

106360


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
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Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

CENTURA TxZ

verified-listing-icon
已验证
类别
CVD
上次验证: 60 多天前
listing-photo-3fa554a4b2644d0691dd43c18978e9df-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

106360


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
HEATER
配置
无配置
OEM 型号描述
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.
文件

无文件