说明
Chamber MGI Electronics Wafer Transfer Systems qty 4 Leitz Secolux 6 x 6 Microscope with Nidek IM11 Autoloader Gasonics L3300 Plasma Asher 6 inch qty 2 FEI Quanta 200 Scanning Electron Microscope Four Dimensions CVMAP 3092-A Wafer CV Mapper and Mercury probe Lam Research 2080 TCU Dual Channel Chiller qty 6配置
无配置OEM 型号描述
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.文件
无文件
类别
CVD
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
137235
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA TxZ
类别
CVD
上次验证： 10 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
137235
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Chamber MGI Electronics Wafer Transfer Systems qty 4 Leitz Secolux 6 x 6 Microscope with Nidek IM11 Autoloader Gasonics L3300 Plasma Asher 6 inch qty 2 FEI Quanta 200 Scanning Electron Microscope Four Dimensions CVMAP 3092-A Wafer CV Mapper and Mercury probe Lam Research 2080 TCU Dual Channel Chiller qty 6配置
无配置OEM 型号描述
The Centura TxZ is a chemical vapor deposition (CVD) system that is used for depositing thin films of various materials on semiconductor wafers. It can be used with 8” wafer size and CVD system size is also 8”. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum. In September 1996, the Liner TxZ Centura system was launched. This system combines a new CVD TiN chamber with a Coherent PVD Ti chamber, and allows for deposition of sequential layers of Ti and CVD TiN in high-aspect-ratio metal structures under vacuum.文件
无文件