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W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM 型号描述
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.文件
无文件
类别
CVD
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
69602
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
CONCEPT TWO "C2"
类别
CVD
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
69602
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
W deposition with pulsed nucleation layer (PNL ) hardware and process capability Reactive Plasma Clean ( RPC) hardware. Chamber system that uses plasma NF3 rather than C2F6 Minimal Ovelap Exclusion Ring ( MOER)- keeps W from depositing on the edge of the wafer Installation & TrainingOEM 型号描述
The NOVELLUS CONCEPT TWO is a modular, integrated production system that is capable of depositing both dielectric and conductive metal layers by combining one or more processing chambers around a common, automated robotic wafer handler. It was introduced in November 1991.文件
无文件