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KLA AIT I
    说明
    Patterned Surface Inspection System
    配置
    Auto - Model: AIT I Main System - KLA-Tencor AIT I Mainframe - Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and Documentation
    OEM 型号描述
    The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
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    KLA

    AIT I

    verified-listing-icon

    已验证

    类别

    Defect Inspection
    上次验证: 60 多天前
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    60830


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    1997

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
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    上次验证30 多天前

    KLA

    AIT I

    verified-listing-icon

    已验证

    类别

    Defect Inspection
    上次验证: 60 多天前
    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/4f62775531994c9a8510895e3fd57a4a_89d08eb88537413cb8eec3f1509f51151201a_mw.jpeg
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    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/d72d492b50574ec9b3e7490da0073064_00963b18138849b48231da996a18d9051201a_mw.jpeg
    listing-photo-1b550ff0d4b649a4b1c15de499e5ed5c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/49849/1b550ff0d4b649a4b1c15de499e5ed5c/fb701d50fd0645d4bee09bcf546e9766_a4917f3dd6484f378944b8841299919b1201a_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    60830


    晶圆尺寸:

    6"/150mm, 8"/200mm


    年份:

    1997


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Patterned Surface Inspection System
    配置
    Auto - Model: AIT I Main System - KLA-Tencor AIT I Mainframe - Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and Documentation
    OEM 型号描述
    The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.
    文件

    无文件

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