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说明
无说明配置
- Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and DocumentationOEM 型号描述
The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.文件
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KLA
AIT I
类别
Defect Inspection
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
15509
晶圆尺寸：
6"/150mm, 8"/200mm
年份：
1997
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说明
无说明配置
- Currently Configured for 6"/150mm & 8"/200mm Wafers - Double Darkfield Inspection Tool - SECS II/GEM Communication Interface - Low Contact Chuck (AIT I) - Multi Channel Collection Optics System with Independent Programmable Spatial Filters - Pentium CPU with Windows NT Installed - Wafer Transfer Area Housing Cover - Wafer Handling Module - High Voltage Electronics - Front and Rear EMO’s with Covers - Flat Panel Display for AIT - Fold Down Keyboard Tray with Built In Mouse - X/Y Drive/Controller Chassis and Motion Controller Card - Blower Box (exhaust hoses not included) - Operations Manual and DocumentationOEM 型号描述
The AIT In-line Defect Inspection System is a high-throughput system that uses proprietary double-darkfield (DDF) laser scanning technology to detect defects, microscratches, and particulate contamination on wafers. It can inspect up to 30 wafers per hour at maximum sensitivity and has a low cost-per-inspection, making it economically feasible to perform in-line process monitoring at more process levels. The system achieves exceptional defect sensitivity through innovations such as a reduced laser spot size and a unique double-darkfield laser scattering design.文件
无文件