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TEL / TOKYO ELECTRON TRIASe+ EX-II TiN
    说明
    无说明
    配置
    Three Port Loader Main Body (MISSING ROBOT) Four Chamber with Heater Power Rack HD include
    OEM 型号描述
    The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.
    文件

    无文件

    类别
    Deposition

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    123107


    晶圆尺寸:

    12"/300mm


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    TEL / TOKYO ELECTRON

    TRIASe+ EX-II TiN

    verified-listing-icon
    已验证
    类别
    Deposition
    上次验证: 60 多天前
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    listing-photo-8a60f5b690384500860f7d1962822921-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78834/8a60f5b690384500860f7d1962822921/6cae8aeacd1f4a42acfdd2366a4c04d5_193be1360a034eba85fda4bc890c65ff_mw.png
    listing-photo-8a60f5b690384500860f7d1962822921-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78834/8a60f5b690384500860f7d1962822921/f8f241d40cb843fe864e3a79a108da85_1d601edcffb24ef88eeb06f8d2bef725_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    123107


    晶圆尺寸:

    12"/300mm


    年份:

    2015


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    Three Port Loader Main Body (MISSING ROBOT) Four Chamber with Heater Power Rack HD include
    OEM 型号描述
    The Triase+™ EX-II™ TiN (Titanium Nitride) is an advanced 300mm single wafer deposition system for high speed ASFD which enables high-quality thin film formation with excellent within-wafer uniformity and high step coverage characteristics. Featuring an optimized reactor design with new gas injection module, the system achieves high productivity even in the leading-edge semiconductor device manufacturing, and is used for various applications including formation of contact barriers, capacitor electrodes, word line barriers and metal gates.
    文件

    无文件