说明
Die Bonder配置
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM 型号描述
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文件
无文件
ASM
AD8912
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72286
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
AD8912
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
72286
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Die Bonder配置
Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)OEM 型号描述
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文件
无文件