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ASM AD8912
    说明
    Die Bonder
    配置
    Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)
    OEM 型号描述
    AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
    文件

    无文件

    verified-listing-icon

    已验证

    类别
    Die Bonders / Sorters / Attachers

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    62756


    晶圆尺寸:

    12"/300mm


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ASM

    AD8912

    verified-listing-icon
    已验证
    类别
    Die Bonders / Sorters / Attachers
    上次验证: 60 多天前
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/5c07dd4b9f264bed87d2409cdd541223_3665895112cd491aba4d51a6983b6e9d45005c_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/d21691246b024b449de0ba8c39f18c56_66c5ac9e46c1487b88c73c353b4123f8_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/739514e8ab28455fa3f10a86d36e12bb_2e676a5202fd4e7e91531b011ff164761201a_mw.jpeg
    listing-photo-cc6c4fb956114a059e0f4e9303a209f0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/cc6c4fb956114a059e0f4e9303a209f0/98884d270524415fb21fdd45c6c465af_673ead9c18444eebbb4d8445bb16f50845005c_mw.jpeg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    62756


    晶圆尺寸:

    12"/300mm


    年份:

    2004


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Die Bonder
    配置
    Wafer Diameter Maximum 12" (300 mm) Wafer XY Table Travel (13” x 13”) 334 x 334mm Die Size (10 x 10 mil to 1000 x 1000 mil) Die Placement Accuracy XY (0.38 mil)8.38um Epoxy Fillet Height (<2/3 of die thickness) BLT typically 1 0.2mil die size (material dependent) Work holder Indexer (linear motor) Pick/Bond Head (Linear Motor) Qty. 2 Ejector System Wafer Handling System Vision System Dispensing system (Musashi Pump) Epoxy Writer System (Disposal Nozzle)
    OEM 型号描述
    AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.
    文件

    无文件