说明
Die Bonder配置
无配置OEM 型号描述
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文件
无文件
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SELLER
ASM
AD8912
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
Buyer pays 12% premium of final sale price
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
106655
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Die Bonder配置
无配置OEM 型号描述
AD8912 epoxy die bonder for 300mm wafers. With its capability to handle up to 300mm wafers, fully automatic operation, epoxy writer, pre and post bond inspection and wafer mapping.文件
无文件