说明
No missing parts配置
* Multi-chip module - Flip chip and die attach tasks can be executed in just one module * Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space * Key specifications Die handling from 0,17 mm - 50 mm, Placement accuracy of ±10 µm @ 3s (cmk = 1,33) * Operator friendly - Despite the wide range of fittings and set-up options, the operation of the 2200 EVO is easy to learn - just as used for the 2200 platform. Date a transfer via TCP/IP networks is naturally implemented, and the user interface is menu-driven. Flexibility - Even the standard module of the 2200 EVO die bonders can be very variably equipped. * Slide flux is not included * Heated options - Heated bond head (up to 350 °C) and substrate heating (up to 150 °C) are available to convert today's and tomorrow's demands of heat-requiring applications.OEM 型号描述
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.文件
BESI / DATACON
2200 EVO
已验证
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
89162
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 EVO
类别
Die Bonders / Sorters / Attachers
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
89162
晶圆尺寸：
未知
年份：
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available