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HITACHI HS-9050
    说明
    The 2019 Hitachi High-Technologies Dry Etch / Plasma Asher is engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications. Its advanced technology ensures uniformity and high throughput, making it ideal for both production and research settings. This equipment is designed to meet stringent industry standards, providing reliability and enhanced performance in the manufacturing process. The
    配置
    Retronix Semiconductor is pleased to present a 2019 Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher, configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. HDD has been removed and no software is included. This is a modern, high-performance platform suited to facilities seeking reliable dry etch capability without extended OEM lead times.
    OEM 型号描述
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    文件
    verified-listing-icon

    已验证

    类别
    Dry / Plasma Etch

    上次验证: 今天

    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled / Palletized


    产品编号:

    143434


    晶圆尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch
    年份: 2019状况: 二手
    上次验证今天

    HITACHI

    HS-9050

    verified-listing-icon
    已验证
    类别
    Dry / Plasma Etch
    上次验证: 今天
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/f67482056192428387932f4955cb83ee_19a89014dac144409d1bc96bc873bbd3e2_mw.png
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/0d37d87b6c764b7faf08a835f4c49322_ca2ed377f8494c6d91f0885eb74b57a2edit3_mw.png
    listing-photo-4e2813579ec14e89b21bf74c32067966-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91070/143434/02bc3015c7794ce1b810525f36b4e47f_3253430e288b4ad988edba3aefeb8259edit4_mw.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    Deinstalled / Palletized


    产品编号:

    143434


    晶圆尺寸:

    未知


    年份:

    2019


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    The 2019 Hitachi High-Technologies Dry Etch / Plasma Asher is engineered for precision processing, optimizing etching and ashing capabilities in semiconductor applications. Its advanced technology ensures uniformity and high throughput, making it ideal for both production and research settings. This equipment is designed to meet stringent industry standards, providing reliability and enhanced performance in the manufacturing process. The
    配置
    Retronix Semiconductor is pleased to present a 2019 Hitachi High-Technologies HS 9050 Dry Etch / Plasma Asher, configured for high-current operation (150A, 3Ø AC 208V). This 12” multi-chamber platform comprises: Five Asher / Etch chambers Two Cooling chambers Integrated transfer modules Mini-Environment Wafer Loading Module (EFEM) The system is configured for copper processing. HDD has been removed and no software is included. This is a modern, high-performance platform suited to facilities seeking reliable dry etch capability without extended OEM lead times.
    OEM 型号描述
    HS-9050 is equipped with a gas system compatible with both organic and inorganic films. Processing can be flexibly set based on the structure of the film layers, enabling the entire removal process of multilayer resists in next-generation devices to be performed within the same chamber. Meanwhile, helical downflow plasma has been newly adopted as the plasma source, resulting in a highly efficient, less damaging process.
    文件
    类似上架物品
    查看全部
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch年份: 2019状况: 二手上次验证:今天
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch年份: 2019状况: 二手上次验证:60 多天前
    HITACHI HS-9050

    HITACHI

    HS-9050

    Dry / Plasma Etch年份: 2019状况: 二手上次验证:60 多天前