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说明
ELECTROPLATER, CU配置
无配置OEM 型号描述
SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.文件
无文件
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79958
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / NOVELLUS
SABRE
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
79958
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
ELECTROPLATER, CU配置
无配置OEM 型号描述
SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.文件
无文件