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LAM RESEARCH / NOVELLUS SABRE
    说明
    Complete tool
    配置
    无配置
    OEM 型号描述
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    文件

    无文件

    LAM RESEARCH / NOVELLUS

    SABRE

    verified-listing-icon

    已验证

    类别
    Electro Plating

    上次验证: 30 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    110189


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro Plating
    年份: 0状况: 二手
    上次验证30 多天前

    LAM RESEARCH / NOVELLUS

    SABRE

    verified-listing-icon
    已验证
    类别
    Electro Plating
    上次验证: 30 多天前
    listing-photo-9fa148bd90a64a6e948258c866d0f17b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73365/9fa148bd90a64a6e948258c866d0f17b/4b84f720db904e5b83931446d34a8177_wechatimg15_mw.jpg
    listing-photo-9fa148bd90a64a6e948258c866d0f17b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73365/9fa148bd90a64a6e948258c866d0f17b/af5fedc7f99143ba99d502665e532489_wechatimg17_mw.jpg
    listing-photo-9fa148bd90a64a6e948258c866d0f17b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73365/9fa148bd90a64a6e948258c866d0f17b/771d3f08293e4612bbed755754387a9d_wechatimg14_mw.jpg
    listing-photo-9fa148bd90a64a6e948258c866d0f17b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73365/9fa148bd90a64a6e948258c866d0f17b/53f6ff0eba0e4230af0ccd133a22a97a_wechatimg16_mw.jpg
    listing-photo-9fa148bd90a64a6e948258c866d0f17b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/73365/9fa148bd90a64a6e948258c866d0f17b/7c29fedd9c2346f3b725bbf36d81b8af_wechatimg18_mw.jpg
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    110189


    晶圆尺寸:

    8"/200mm


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Complete tool
    配置
    无配置
    OEM 型号描述
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    文件

    无文件

    类似上架物品
    查看全部
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro Plating年份: 0状况: 二手上次验证:30 多天前
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro Plating年份: 0状况: 二手上次验证:60 多天前
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro Plating年份: 0状况: 二手上次验证:30 多天前