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LAM RESEARCH / NOVELLUS SABRE
    说明
    Convectron Gauge
    配置
    无配置
    OEM 型号描述
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    文件

    无文件

    类别
    Electro Plating

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    16378


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    LAM RESEARCH / NOVELLUS

    SABRE

    verified-listing-icon
    已验证
    类别
    Electro Plating
    上次验证: 60 多天前
    listing-photo-fAZ1tajmwshLTzqWdLkSQXA87R9JQkTKHH3AovWVi9g-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/Ot4uSyt7j-OkIRBJeE4orTieeZmN71mOLX5X1zTe7fk/fAZ1tajmwshLTzqWdLkSQXA87R9JQkTKHH3AovWVi9g/laHFB4ZdJ0AsUiKzC9eEdRjDT-aDO4JGKPZ2X1kfh2Y_20190315_091910_f
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    16378


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Convectron Gauge
    配置
    无配置
    OEM 型号描述
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    文件

    无文件