说明
With HDD配置
-Software OS: Linux -Process: PYRO -Type: DIFF -AIR VALVE: FUJIKIN, CKD -Heater: VOS-40-017 3471206Z2164 -MFC,MFM: AREA -Three phase power: AC 208V -MAIN: CKD -Single phase power: AC 120V (STEP DOWN TRANS) -APC: CKD -GAS: N2,O2,H2,TLCOEM 型号描述
The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.文件
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TEL / TOKYO ELECTRON
ALPHA-8SE
已验证
类别
Furnaces / Diffusion
上次验证： 17 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115927
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
ALPHA-8SE
类别
Furnaces / Diffusion
上次验证： 17 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
115927
晶圆尺寸：
未知
年份：
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
With HDD配置
-Software OS: Linux -Process: PYRO -Type: DIFF -AIR VALVE: FUJIKIN, CKD -Heater: VOS-40-017 3471206Z2164 -MFC,MFM: AREA -Three phase power: AC 208V -MAIN: CKD -Single phase power: AC 120V (STEP DOWN TRANS) -APC: CKD -GAS: N2,O2,H2,TLCOEM 型号描述
The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.文件
无文件