说明
无说明配置
-300 mm Production with Max production 50 Pcs -2 IO Port ,12 Carrier Stock -Waves System CTL , Temp CTL M780 -Heater Type : VCM series , -Fork Transfer with 5+1 -2 Boat -Gas :N2, SiH4 ,1%PH3/He ,20%F2/N2, H2, O2OEM 型号描述
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.文件
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TEL / TOKYO ELECTRON
TELFORMULA
已验证
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65731
晶圆尺寸：
12"/300mm
年份：
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELFORMULA
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65731
晶圆尺寸：
12"/300mm
年份：
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
-300 mm Production with Max production 50 Pcs -2 IO Port ,12 Carrier Stock -Waves System CTL , Temp CTL M780 -Heater Type : VCM series , -Fork Transfer with 5+1 -2 Boat -Gas :N2, SiH4 ,1%PH3/He ,20%F2/N2, H2, O2OEM 型号描述
TELFORMULA is an advanced thermal processing system designed for the production of 65 to 45-nm-node-generation devices and beyond. It offers a reasonable Cost of Ownership (CoO), a short cycle time, and significantly improved process performance. Some of its key features include an ultra-clean, all-quartz reactor, state-of-the-art heater element technology, high-speed wafer-transfer robotics, and in-situ dry gas cleaning technology. TELFORMULA has a wide range of applications, including radical oxidation (LPRO), ultra-thin gate dielectrics formation (oxidation, nitridation), LPCVD (supporting Poly, Sin, SiO2 / Dry gas cleaning), ultra-low temperature LPCVD, and high-k film formation (AIO, HfO, AIO / HfO, HfSiO). With its advanced technology and versatile capabilities, TELFORMULA is an optimal choice for thermal processing in the semiconductor industry.文件
无文件