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TEL / TOKYO ELECTRON TELINDY
    说明
    Furnace Indy-I-L
    配置
    SEED Poly
    OEM 型号描述
    The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.
    文件

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    类别
    Furnaces / Diffusion

    上次验证: 24 天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    126221


    晶圆尺寸:

    12"/300mm


    年份:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
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    TEL / TOKYO ELECTRON

    TELINDY

    verified-listing-icon
    已验证
    类别
    Furnaces / Diffusion
    上次验证: 24 天前
    listing-photo-11ce6404ee914de98c053d1ba5cbc4c6-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    126221


    晶圆尺寸:

    12"/300mm


    年份:

    2007


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Furnace Indy-I-L
    配置
    SEED Poly
    OEM 型号描述
    The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.
    文件

    无文件

    类似上架物品
    查看全部