说明
Furnace Indy-I-L配置
SEED PolyOEM 型号描述
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.文件
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类别
Furnaces / Diffusion
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
126221
晶圆尺寸：
12"/300mm
年份：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELINDY
类别
Furnaces / Diffusion
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
126221
晶圆尺寸：
12"/300mm
年份：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Furnace Indy-I-L配置
SEED PolyOEM 型号描述
The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.文件
无文件