说明

Unit Name - W × D x H Furnace section - 1100 X 3825 X 3631.5 Gas Box - 235 X 800 X 3086.5 Power Box - 1100 X 1100 X 2000 Safety Specification - SEMI S2-0703 / CE Heater Model - Mid-Temp, VMM-56-002 5zone / 500-1000℃ Process Condition - LP Maximum Operation Temperature (℃) - 450℃ ART Control - None N2 Load Lock - Yes Wafer Type - 300mm-SI SEMI STD-Notch QTY of production wafers - 100 Boat Operation (Handling Position) - 1 Boat Type (B/E) Software Version (WAVES) - Latest Version

配置

Poly 4 DIFF (D-POLY)

OEM 型号描述

The TELINDY is a 300mm wafer processing platform that combines the advantages of the TELFORMULA and ALPHA(α)-303i platforms to meet the demands of high-volume thermal processing for sub-45nm technology. It offers a large 125-wafer batch size, high-speed robotics, and other improvements for cost-effective processing of various oxidation and deposited films. The TELINDY platform is suitable for a range of applications, including general oxidation/anneal, radical oxidation, LPCVD films, ultra-low temperature LPCVD applications, and high-k dielectrics. It features in-situ dry gas cleaning technology, a fast ramp-up and cool-down heater, high-speed robotics, and a large 125-wafer load size. These features make the TELINDY an excellent choice for cost-effective and efficient wafer processing.