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说明
无说明配置
无配置OEM 型号描述
The Quantum X Plus is a groundbreaking single-wafer, high-current implanter that has set new standards in 65nm production. It offers superior low-energy, high-dose performance, enabling device scaling and delivering exceptional capabilities for Logic and Memory applications. The implanter's fixed beam technology, combined with a precision mechanical scanning system, provides unmatched features such as defect engineering for ultra-shallow junction formation below 45nm and precise angle control for advanced memory structures. When paired with the Applied Vantage RadiancePlus RTP, the Quantum X Plus forms a powerful combination, incorporating cutting-edge co-implantation and defect engineering technology to meet both current and future high-current implantation requirements. Key features of the Quantum X Plus include the highest productivity for ultra-shallow junction formation across a wide energy range, two-dimensional parallel scanning with StepScan for precise angle control and iso-centric scanning for high tilt applications, advanced motion control for optimal crystal defect management, and predictive and managed uniformity for consistent implant results.文件
无文件
类别
High Current
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
32096
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
QUANTUM X PLUS
类别
High Current
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
未知
产品编号：
32096
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The Quantum X Plus is a groundbreaking single-wafer, high-current implanter that has set new standards in 65nm production. It offers superior low-energy, high-dose performance, enabling device scaling and delivering exceptional capabilities for Logic and Memory applications. The implanter's fixed beam technology, combined with a precision mechanical scanning system, provides unmatched features such as defect engineering for ultra-shallow junction formation below 45nm and precise angle control for advanced memory structures. When paired with the Applied Vantage RadiancePlus RTP, the Quantum X Plus forms a powerful combination, incorporating cutting-edge co-implantation and defect engineering technology to meet both current and future high-current implantation requirements. Key features of the Quantum X Plus include the highest productivity for ultra-shallow junction formation across a wide energy range, two-dimensional parallel scanning with StepScan for precise angle control and iso-centric scanning for high tilt applications, advanced motion control for optimal crystal defect management, and predictive and managed uniformity for consistent implant results.文件
无文件