We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 型号描述
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti文件
无文件
KDF / MRC
603
类别
PVD / Sputtering
上次验证： 4 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
128787
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
3 Magnetron Sputtering Cathodes up to 10KW (T1 MRC Planar DC/RF, T2 MRC Inset DC, T3 MRC Inset DC) 1 AE MDX Power Supply 10 KW 1 Cryo Pump CTI 8 Installed in Process Chamber (NO Cryo in LL) 1 Cryo Compressor CTI 8200 1 Etch Station (Hard Etch 13,56 Mhz, ENI ACG-10B) 1 Heat Station in Etch Position Real Time Controller PLC Mitsubishi Windows PC for User InterfaceOEM 型号描述
The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti文件
无文件