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Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.文件
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DISCO
DFD6341
类别
Scribing, Cutting, Dicing
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116461
晶圆尺寸：
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
年份：
2017
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说明
无说明配置
Process: Wafer Dicing Mode: Fully-autoOEM 型号描述
The DFD6341 is a fully automatic dual spindle dicing saw for Φ8-inch wafers made by DISCO Corporation. It incorporates throughput enhancement technology developed in DFD6362 for Φ300 mm wafers and has a uniquely developed axis mechanism that enables X-axis return speeds up to 1,000 mm/s.文件
无文件